Standard for 450 mm

The first was made an initial standard of 450-millimeter silicon slices. Organization of Sematech, which brings together firms producing patches and devices to make integrated circuits has decided that it would be some thick slices of 925 microns, plus or minus 25 micrometers. Currently used 300-millimeter slices with a thickness 775 microns.

In November Sematech will meet again to decide to "test slice thickness. Currently specified thickness, it is in fact a theoretical goal. "The thickness of the test" is to be no longer a practical standard. Most likely, however, it will not deviate from the set is 925 microns.

In the coming years there will also test factories, which will be checked future production lines. Experts await a lot of work, not least because the 450-millimeter slices they weigh 330 grams and can bend under their own weight. Currently used in production lines must then be processed so as to prevent bending.

Despite already begun work on standards, many companies do not want to engage in them. They argue that the transition to 450-millimeter silicon slices is too expensive and technology currently used 300-millimeter slices is sufficient for most applications. In their view, the industry should focus on improving current practices, rather than drafting new ones.

Source: kopalniawiedzy.pl

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